全球领先的湿法化学度量技术供应商ECI Technology近日宣布一家欧洲知名的半导体研究中心成功装载了On-Line Quali-Line QLC-7500 Chemical Monitoring System（CMS）。ECI Technology将在近期举行的SEMICON China中参展，展位号是4722。

QLC-7500是一台在线分析设备，可用来监测和控制硅通孔（TSV）铜淀积工艺。它能精确测量电镀和填充工艺中无机成分和所有有机添加物的浓度。QLC-7XXX化学检测系统是铜电镀（大马士革）工艺最常用的分析设备，全球主要的半导体制造商均选择该系列设备。

MAJOR EUROPEAN RESEARCH CENTER INSTALLS ECI’s QUALI-LINE CHEMICAL MONITORING SYSTEM FOR TSV

Totowa, NJ – March 5, 2009 – ECI Technology, a market leader and premier innovator in wet chemical metrology, announced today that a major European semiconductor research center has successfully installed its On-Line Quali-Line QLC-7500 Chemical Monitoring System (CMS). ECI exhibits at Semicon China booth No. 4722.

QLC-7500 is an on-line analyzer which is being used to monitor and control the Thru-Silicon Via (TSV) Copper deposition process. It accurately measures the concentrations of all the organic additives as well as the in-organic constituents of the plating or filling solution. QLC-7XXX chemical monitoring systems are the most popular analyzers for Copper electro-deposition (Damascene) processes used by all major semiconductor manufacturers world wide.

“This installation is a significant milestone for ECI as it reinforces company’s world-wide leadership in wet chemical monitoring and control” said Marianna Rabinovitch, President and CEO, ECI Technology. “TSV is a challenging process, which requires precise and reliable control of chemical concentrations, and now it becomes much more feasible, understandable and efficient process thanks to Quali-Line’s online analysis. This implementation will support integration of TSV by high volume manufacturers as they seek to accommodate smaller, more complex geometry integrated circuits (ICs), and witness the cost, performance and yield advantages afforded by reliable TSV filling”.
The market for TSV is expected to experience significant growth in the next several years as part of the emergent need for smaller, but powerful multi-functional electronic devices such as smart phones, cameras, notebooks, etc. Copper TSV allows manufacturers to stack multiple layers of components by wiring them directly with large amount of tiny “wires”, thus reducing the size of the package and its internal resistivity.

About ECI Technology:
ECI Technology is the leading provider of Chemical Monitoring Systems, used by the world''s tier-1 chip manufacturers. The company works closely with its customers as well as the most advanced research centers to develop cutting edge analytical procedures in the electroplating, electroless deposition, and wet processing fields. ECI''s key technologies include CVS (Cyclic Voltammetric Stripping), CPVS (Cyclic Pulse Voltammetric Stripping), MPVS (Modified Pulse Voltammetric Stripping), SERA (Sequential Electrochemical Reduction Analysis), Potentiometric Titration, Spectrometry, and Multivariate Analysis. Among these, ECI''s proprietary CVS technique has become the INDUSTRY STANDARD for plating bath control.
ECI continues to push the boundaries of performance and efficiency in order to conform to the industry''s tightening specifications, the demand for a lower CoO, and reduction of environmental waste.