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应用于IC和纳米器件的等离子体蚀刻和淀积设备设计与制造商Tegal Corporation日前宣布，收到一家全球领先的离散及逻辑器件制造商关于Endeavor AT PVD设备的订单。此套设备预计在本季度发货，用于薄晶圆后道金属化制程。

Tegal公司PVD产品经理Pavel Laptev表示，我们向客户成功展示了Endeavor AT PVD在薄晶圆后道金属化制程中拥有卓越的晶圆传送(wafer handling)及薄膜胶粘(film adhesion)能力。在此基础上，我们非常高兴收到该客户的订单。一旦Endeavor AT设备投入量产，我们相信给客户带来的不仅是生产线良率还有器件良率的双双提升。

Tegal Endeavor AT 是一款技术先进超高真空的PVD设备，再超级洁净的工艺环境中，沉积高一致高纯度的薄膜，应力可以低至零。低应力薄膜应用广泛，比如功率及离散器件的后道金属化、凸块底层金属化、先进封装、光刻模板及高亮度LED以及FBARs与RF MEMS的电声器件等。

TEGAL RECEIVES ENDEAVOR AT PVD TOOL ORDER FROM MAJOR GLOBAL MAKER OF DISCRETE AND ANALOG SEMICONDUCTOR COMPONENTS

Endeavor AT will improve volume production line yield and device yield on
thin wafer backside metallization applications for first-time Tegal customer


Petaluma, Calif., May 28, 2008 — Tegal Corporation (Nasdaq TGAL), a leading designer and manufacturer of plasma etch and deposition systems used in the production of integrated circuits, MEMS, and nanotechnology devices, announced today that the Company received an order for an Endeavor AT PVD cluster tool from a leading global manufacturer of discrete and analog semiconductor components for the consumer electronics, industrial, and automotive markets. The Endeavor AT PVD system will ship this quarter, and will be used by Tegal’s customer for backside metallization applications on thin wafers at the customer’s domestic, ISO-certified wafer fab.

“We successfully demonstrated the superior wafer handling and film adhesion capabilities of the Endeavor AT PVD system for thin wafer backside metallization applications to our customer, and we are pleased to have been selected for this order on the basis of those results,” said Pavel Laptev, PVD Product Manager, Tegal Corporation. “Once the Endeavor AT tool is released into volume production, we are confident our customer will see improvements for this critical application in both their line and device yields. The S-Gun deposition module at the heart of the Endeavor is key to its versatility in handling thin wafers and providing superior metal film adhesion results while allowing tight control over film stress.”

The Tegal Endeavor AT system is a state-of the-art, ultra-high vacuum PVD cluster tool used in production fabs to deposit consistent, high purity films, with low to zero stress values, in an extremely clean process environment. Low stress films are widely utilized in backside metallization for power and discrete devices, under-bump metallization applications, advanced packaging, photo masks (including EUV), high-brightness light emitting diodes (HB-LEDs), and in creating electro-acoustic devices for FBARs and RF MEMS. The Endeavor AT has an easy-to-use GUI, SECSGEM communication, reliable low-contact wafer handling, and flexible wafer shape and size capability, that makes it ideal for ultra-clean production environments for both front-side and back-side applications. Optional damage-free soft-etch modules, and a variety of DC, AC, and RF magnetron configurations, are available to sputter the many different dielectric and conductive films used in semiconductor, MEMS, and other electronic device production.

Safe Harbor Statement
Except for historical information, matters discussed in this news release contain forward-looking statements within the meaning of Section 27A of the Securities Act and Section 21E of the Exchange Act. Forward-looking statements, which are based on assumptions and describe our future plans, strategies and expectations, are generally identifiable by the use of the words anticipate, believe, estimate, expect, intend, project or similar expressions. These forward-looking statements are subject to risks, uncertainties and assumptions about the Company including, but not limited to industry conditions, economic conditions, acceptance of new technologies and market acceptance of the Company''s products and services. All forward-looking statements attributable to us or persons acting on our behalf are expressly qualified in their entirety by the cautionary statements in this paragraph. For a further discussion of these risks and uncertainties, please refer to the Company''s periodic filings with the Securities and Exchange Commission.


About Tegal
Tegal provides process and equipment solutions to leading edge suppliers of advanced semiconductor, MEMS, and nanotechnology devices. Incorporating unique, patented etch and deposition technologies, Tegal’s system solutions are backed by over 35 years of advanced development and over 100 patents. Tegal is represented exclusively by WESI Technology in Greater China markets.

For more information about Tegal Corporation, call WESI Technology at (021) 6165-2231 or visit www.tegal.com

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来源:SEMI 作者: 时间:2008/6/2 0:00:00