包封料[半导体]_老古开发网文章

包封料

发布时间:2005年11月1日点击次数:290

　　NoSWEEP EW8000和EW8001是两种液体滴胶封装包封料,主要用于保护各种球栅阵列封装以及在引线键合封装中防止引线丝歪斜。它们都通过了JEDEC Level 2A 260°C的可靠性测试,可以用于窄节距应用作为滴胶封装或者围堰填充的包封料。另外,EW8000还可满足高可靠性和/或高回流温度的要求。
　　Polysciences Inc., www.polysciences.com.　　

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