The 2800 Series is a brightfield wafer inspection platform that enables wide capture of critical defects across all layers without compromise. It provides users with ultra-broadband wavelength inspection at twice the throughput of previous-generation DUV imaging tools. Selectable wavelength ranges from 260 to 450 nm, and TDI sensors and ultra-broadband illumination reduces the damage risk and sensitivity trade-offs. The system also features custom-built, large-field catadioptric optics, which provide high NA across all illumination modes and sensitivity settings. KLA-Tencor Corp.,
　　www.kla-tencor.com.