Avago Technologies introduced an E-pHEMT (enhancement-mode pseudomorphic high-electron-mobility transistor) power amplifier specifically designed for IEEE 802.11b/g mobile wireless local area networks (WLANs). Avago’s MGA-412P8 features high linear output power at the industry’s lowest operating current with a shutdown function to conserve battery power, and is supplied in a tiny 2 mm x 2 mm LPCC (leadless plastic chip carrier) package.

Avago’s MGA-412P8 power amplifier is perfect for portable WLAN applications such as PDAs and mobile handsets, digital cameras, printers and print servers. It is also suitable for use as a power amplifier for RFID transmitters, Bluetooth and other applications in the license-free 2.4 GHz ISM (industrial, scientific and medical) band.

“The industry-best, power-added efficiency of our proprietary E-pHEMT power technology has allowed Avago to develop the first low-current, high linearity power amplifier available in the 802.11b/g market,” said Bryan Ingram, vice president and general manager of Avago Technologies’ Wireless Semiconductor Division. “The device saves significant battery power and reduces board space, which is critical for handheld WLAN products.”

At 2.452 GHz and 3.3 V bias, the MGA-412P8 provides 25.5 dB gain as well as +19 dBm linear power output with IEEE 802.11g OFDM (orthogonal frequency division multiplexing) modulation at a 54 Mbps data rate, and three percent EVM (error vector magnitude) while consuming only 95 mA current. For 802.11b CCK (complementary code keying) at 11 Mbps the MGA-412P8 provides +23 dBm linear Pout at only 200 mA current. Typical reverse isolation is greater than 40 dB, and typical quiescent current only 40 mA.

Other features include integrated power detector and power-down functions, and operation from a single +3.3 V supply. During shutdown, the power amplifier draws only 5 microamps typical. The MGA-412P8 is supplied in the compact, industry-standard 2.0 mm x 2.0 mm x 0.75 mm, 8-pad JEDEC DRP-N LPCC leadless plastic chip carrier -- the smallest package used for 802.11 power amplifiers. The package’s lead-free backside metalization provides excellent thermal dissipation as well as visual evidence of solder reflow.