E-mail:train@smtworld.cn
South China Training Date: 2011-9-22-24
Venue: Shenzhen
Training Price: RMB3000/Per Student(No IPC-A-610E Dish)
IPC-A-610E“Acceptability of Electronic Assemblies”
Certified IPC Specialist (CIS) Course Overview & schedule
Module Course Hours
Module 1 Introduction/IPC Professional Training and Certification Policies and Procedures Certification Programs、Certification Term、Obligations of Participant’s、Certified IPC Trainers、Certified IPC Specialists retesting etc..
1
Module 2 Foreword, Applicable Documents, & Handing Scope、Purpose、Specialized Designs、Terms & Definitions、Examples and Illustrations、Inspection Methodology、Verification of Dimensions、Magnification Aids and Lighting、Application Documents、IPC Documents、Handling Electronic Assemblies etc..
1
Module 3 Hardware Installation Hardware Installation、Connectors, Handles, Extractors, Latches、Connector Pins、Wire Bundle Securing、Routing etc.. 1.5
Module 4 Soldering (Including High Voltage) Soldering Acceptability Requirements、Soldering Anomalies and High Voltage etc.. 2
Module 5 Terminal Connections Edge Clip、Swaged Hardware、Wire/Lead Preparation, Tinning、Lead Forming- Stress Relief、Service Loops、Stress Relief Lead/Wire Bend、Lead/Wire Placement、Insulation、Conductor、Terminals-Solder、Conductor Damage Post-Solder etc.. 1
Module 6 Through-Hole Technology Component Mounting、Heatsinks、Component Securing、Unsupported Holes、Supported Holes、Jumper Wires etc.. 2
Module 7 Surface Mount Assemblies Staking Adhesive、SMT Connections(Bottom Only Terminations Chip Component、1,3 or 5 Side Termination Chip Component、Cylindrical End Cap Termination、Castellated Terminations、Flat Ribbon, L, and Gull Wing Leads、Round or Flattened (Coined) Leads、J Leads、I Leads、Butt/I Joints、Flat Lug Leads、BGA、PQFN etc..)、Jumper Wires etc.. 3
Module 8 Component Damage and Printed Circuit Boards and Assemblies Printed Circuit Boards and Assemblies(Gold Fingers、Laminate Conditions、Marking、Cleanliness、Coating)、Component Damage etc.. 1.5
Module 9 Solderless Wire Wrap Solderless Wrap、Number of Turns、Turn Spacing、End Tails, Insulation Wrap、Raised Turns Overlap、Connection Position、Wire Dress、Wire Slack、Wire Plating、Damaged Insulation、Damaged Conductors & Terminals etc.. 2
Module 10 Exam Open test and Closed test 5