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库力索法半导体(苏州)有限公司招聘单位简介：
库力索法(苏州)有限公司是注册在新加坡工业园区的一家美资新公司，投资金额4500万美金，在半导体连接器件内属领先地位，主要经营制造及组装半导体设备和用于半导体封装及测试的消耗性器具\测试产品,并从事与上述产品有关的研发设计工艺开发及售后服务。
单位网址：
联系方式：
地址：苏州工业园区苏虹中路255号
邮编：215021
传真：62580217
EMAIL： chwang@kns.com,cnjshi@kns.com
招聘职位：
注：所有职位均有国外培训机会
设招为主，由相关经验的优秀应届毕业生也可以考虑
欢迎转发至其他高校的bbs
1. (Senior) Embedded Software Engineer-- 5
Duties and Responsibilities:
· Specify, Design, develop and test application and embedded software for high-speed wire bonder,
focusing on control system and hard real-time. A wire bonder is a manufacturing capital equipment
machine used in the semiconductor industry.
· Participate in software development process improvements that increase the velocity and reduce
the cost by which software features are specified, designed, implemented, tested, and made available
to customers.
· Travel internationally
o Other development sites: US, India ~4x/yr,
o Customers in the Pacific Rim ~4x/yr
Required Experience and Skills:
· Three or more years (3+) developing embedded software.
o Understanding of hardware and software interactions
o Device drivers
o Multi threaded software
· Three or more years (3+) developing object oriented software, including
o Design
o Automated Regression Testing
· Excellent analytical skills, including
o Software modeling, performance, testability, extendibility, and reuse
o Defect resolution
· Excellent communication skills with other developers and managers
· Work independently under tight deadline pressures
· English Proficiencies:
o Read and write proficiently in English.
o Understand spoken English
· Education: Masters’ degree in electrical engineering or computer science, or
Bachelor’s degree in engineering, physical science and 2 or 3 yrs of additional experience,
or equivalent experience.
· Desired beneficial experiences and skills, but not absolutely required:
o Speak English, and be understood by a native English speaker
o C/C++ in Unix environment
o VxWorks OS
o PowePC platform
o Design with UML
o TDD, Test Driven Development (Agile technique of writing test cases before coding)
===========================================================================
2. Senior Embedded Software Test Engineer -- 1
Duties and Responsibilities:
· Design, develop & execute tests to ensure product verification & specification
compliance for high-speed wire bonder, focusing on control system and hard real-time.
A wire bonder is a manufacturing capital equipment machine used in the semiconductor industry.
· Perform functional, integration and system level testing.
· Provide engineering support to internal & external customers
· Effectively communicate issues cross-functionally and with project management
· Review specification documents to prepare test documentation & effort estimates
· Participate in Software Requirement Specification(SRS) reviews for completeness & accuracy
· Timely completion of product verification within defined schedule and generate defect reports
· Travel internationally
o Other development sites: US, India, SG ~2x/yr,
o Customers in the Pacific Rim ~2x/yr
Required Experience and Skills:
· Three or more years (3+) working in embedded software testing
o Understanding of Software QA process
o Considerable hardware & software knowledge, PowerPC and VxWorks is highly preferred
· Good analytical & test skills, & knowledge of lab test equipments
· Excellent communication skills with other team members and managers
· Work independently under tight deadline pressures
· English Proficiencies:
o Read and write proficiently in English.
o Understand spoken English
· Education: Masters’ degree in electrical engineering or computer science, or
Bachelor’s degree in engineering, physical science and 2 or 3 more yrs of additional experience,
or equivalent experience.
· Desired beneficial experiences and skills, but not absolutely required:
o Speak English, and be understood by a native English speaker
o Test Automation experience
======================================================================
3. Embedded Software Test Engineer - 1
Duties and Responsibilities:
· Design, develop & execute tests to ensure product verification & specification
compliance for high-speed wire bonder, focusing on control system and hard real-time.
A wire bonder is a manufacturing capital equipment machine used in the semiconductor industry.
· Perform functional, integration and system level testing.
· Provide engineering support to internal & external customers
· Review specification documents to prepare test documentation & effort estimates
· Timely completion of product verification within defined schedule and generate defect reports
· Travel internationally
o Other development sites: US, India, SG ~2x/yr,
o Customers in the Pacific Rim ~2x/yr
Required Experience and Skills:
· One or two years working in software testing
o Understanding of Software QA process
o Considerable hardware & software knowledge, PowerPC and VxWorks is preferred
· Good analytical & test skills, & knowledge of lab test equipments
· Excellent communication skills with other team members and managers
· Work independently under tight deadline pressures
· English Proficiencies:
o Read and write proficiently in English.
o Understand spoken English
· Education: Bachelor’s degree in engineering, physical science and 1 or 2 yrs of additional experience,
or equivalent experience.
· Desired beneficial experiences and skills, but not absolutely required:
o Speak English, and be understood by a native English speaker
o Test Automation