大会主要涉及半导体封装技术、设计和材料等内容。由中国电子学会及 IEEE-CPMT (USA)、IMAPS (USA)、JIEP (Japan)、IME (Singapore)等组织联合举办。
文章涉及领域包括： Overview on advanced electronic packaging technologies;
Packaging design, modeling and simulation;
Manufacturing technologies;
Packaging materials and components;
Packaging processes: wiring, attaching, bonding, soldering and encapsulation;
Material & process characterization
Reliability and testing;
Interconnecting technologies;
MEMS;
SMT
Industry and marketing.
http://www.icept2003.org
