IBM, Chartered Semiconductor and Samsung have begun work on the 45-nanometer process node, where insulation between gates is expected to be as little as several atoms thick.

While it’s unlikely that the technology will be ready for prime time for several years -- the electronics industry is just beginning to embrace 90 nanometers, for example -- IBM executives said their own goal is to maintain industry leadership for their hardware platforms.

Michael Cadigan, general manager for the OEM Microelectronics Systems and Technology Group, said IBM’s own products need to stay at the bleeding edge of the technology curve. He said the company also defines market success by the success of its customers.

Exactly when the technology will be ready for commercial adoption is unknown, but all companies involved say they will be among the first to bring the technology to market, throwing down the gauntlet for foundries such as TSMC, UMC and even Shanghai-based SMIC to respond.