Taiwan Semiconductor Manufacturing Co. (TSMC) said Wednesday that it has no plans to build a 300mm fab on mainland China.
TSMC also denied reports that it was going to become involved with an IC design house joint venture in China that will be headed by its former VP of marketing, Glenda Hu.
There had been reports in Chinese language press outlets earlier in the week to the contrary. But in a statement posted on its Web site Wednesday, the world''s largest foundry said tha
t its investment and technology transfer in mainland China fully abide with all regulations of the Republic of China (Taiwan), the implication that it would not be investing in any Chinese IC design companies.
TSMC further said that it has no relationship with Hu''s current business undertakings, and that he embarked on his new position by his own choice. According to the Chinese language news reports, as reported in the English language edition of the Taipei Times, Hu will be at the help of a a handset IC design house jointly established by Chinese home-appliance maker TCL Corp and venture capital firms.
TSMC also stated that its affiliated venture capital funds, Emerging Alliance Fund and VTAF II Fund, currently have no investments in any mainland Chinese companies. It further stated that if these funds to invest in mainland Chinese companies in the future, said investments will fully abide by all Taiwanese government regulations.
TSMC also noted that it owns two 300mm fabs, Fab 12 and Fab 14, in the Hsinchu and Tainan Science Parks, respectively, on the island of Taiwan. The foundry said it that given the fact that it is in the process of expanding fab lines at those plants, it has no plans to build any 300mm fabs on mainland China.
However, following reports in Taiwanese media earlier this month that TSMC had applied for permits to build a third 300mm in Taiwan, a TSMC spokesman confirmed to Electronic News that it had indeed applied for the permits.
TSMC also operates a 200mm fab on mainland China in Shanghai, utilizing 0.25-micron processes.
来源:半导体国际 作者: 时间:2005/8/29 0:00:00
